000			01463nam a22001697a 4500
999			_c21781 _d21781
005			20220928150437.0
008			220923b ||||| |||| 00| 0 eng d
020			_ahbk
082			_a535.01 _bSt894
100			_aZeeshan Asghar, _bBS (Hons Physics), _c2014-2018, _dSupervised by Dr. Ali Hussnain
245			_aStructural Analysis of Anodization of Copper Substrate _c/ Zeeshan Asghar
260			_aLahore : _bDivision of Science & Technology, University of Education _c2018
300			_a48 p. _eCD
520			_aCopper oxide thin films are amalgamated on the copper substrate at room temperature via by means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then space among electrodes is kept perpetual though out experimentation. Anodization spell changes in a constant as well as regular routine to study the time effect of anodization of Cu, whereas other constraints like voltage, temperature etc. are kept perpetual through the experimental method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as well as the surface morphology of the substrate surface was observed by scanning electron microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O and Cu4O3. The SEM results also approve that the anodization spell affects the surface morphology on substrate surface.
650			_aPhysics--Anodization--Copper--Subtract
942			_cTH