TY  - BOOK
AU  - Zeeshan Asghar,
TI  - Structural Analysis of Anodization of Copper Substrate
SN  - hbk
U1  - 535.01 
PY  - 2018///
CY  - Lahore
PB  - Division of Science & Technology, University of Education
KW  - Physics--Anodization--Copper--Subtract
N2  - Copper oxide thin films are amalgamated on the copper substrate at room temperature via by 
means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then 
space among electrodes is kept perpetual though out experimentation. Anodization spell changes
in a constant as well as regular routine to study the time effect of anodization of Cu, whereas
other constraints like voltage, temperature etc. are kept perpetual through the experimental 
method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as 
well as the surface morphology of the substrate surface was observed by scanning electron 
microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O 
and Cu4O3. The SEM results also approve that the anodization spell affects the surface 
morphology on substrate surface
ER  -