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Structural Analysis of Anodization of Copper Substrate / Zeeshan Asghar

By: Material type: TextTextPublication details: Lahore : Division of Science & Technology, University of Education 2018Description: 48 p. CDISBN:
  • hbk
Subject(s): DDC classification:
  • 535.01 St894
Summary: Copper oxide thin films are amalgamated on the copper substrate at room temperature via by means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then space among electrodes is kept perpetual though out experimentation. Anodization spell changes in a constant as well as regular routine to study the time effect of anodization of Cu, whereas other constraints like voltage, temperature etc. are kept perpetual through the experimental method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as well as the surface morphology of the substrate surface was observed by scanning electron microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O and Cu4O3. The SEM results also approve that the anodization spell affects the surface morphology on substrate surface.
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Copper oxide thin films are amalgamated on the copper substrate at room temperature via by
means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then
space among electrodes is kept perpetual though out experimentation. Anodization spell changes
in a constant as well as regular routine to study the time effect of anodization of Cu, whereas
other constraints like voltage, temperature etc. are kept perpetual through the experimental
method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as
well as the surface morphology of the substrate surface was observed by scanning electron
microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O
and Cu4O3. The SEM results also approve that the anodization spell affects the surface
morphology on substrate surface.

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