Structural Analysis of Anodization of Copper Substrate (Record no. 21781)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01463nam a22001697a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220928150437.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 220923b ||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | hbk |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 535.01 |
| Item number | St894 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Student name | Zeeshan Asghar, |
| Class | BS (Hons Physics), |
| Session | 2014-2018, |
| Supervisor | Supervised by Dr. Ali Hussnain |
| 245 ## - TITLE STATEMENT | |
| Title | Structural Analysis of Anodization of Copper Substrate |
| Statement of responsibility, etc | / Zeeshan Asghar |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc | Lahore : |
| Name of publisher, distributor, etc | Division of Science & Technology, University of Education |
| Date of publication, distribution, etc | 2018 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 48 p. |
| Accompanying material | CD |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Copper oxide thin films are amalgamated on the copper substrate at room temperature via by <br/>means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then <br/>space among electrodes is kept perpetual though out experimentation. Anodization spell changes<br/>in a constant as well as regular routine to study the time effect of anodization of Cu, whereas<br/>other constraints like voltage, temperature etc. are kept perpetual through the experimental <br/>method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as <br/>well as the surface morphology of the substrate surface was observed by scanning electron <br/>microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O <br/>and Cu4O3. The SEM results also approve that the anodization spell affects the surface <br/>morphology on substrate surface. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Physics--Anodization--Copper--Subtract |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Theses |
| Withdrawn status | Damaged status | Home library | Current library | Date acquired | Full call number | Barcode | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|
| UE-Central Library | UE-Central Library | 27.09.2022 | 535.01 St894 | TTH105 | 27.09.2022 | 27.09.2022 | Theses |
