Structural Analysis of Anodization of Copper Substrate
Zeeshan Asghar, BS (Hons Physics), 2014-2018, Supervised by Dr. Ali Hussnain
Structural Analysis of Anodization of Copper Substrate / Zeeshan Asghar - Lahore : Division of Science & Technology, University of Education 2018 - 48 p. CD
Copper oxide thin films are amalgamated on the copper substrate at room temperature via by
means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then
space among electrodes is kept perpetual though out experimentation. Anodization spell changes
in a constant as well as regular routine to study the time effect of anodization of Cu, whereas
other constraints like voltage, temperature etc. are kept perpetual through the experimental
method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as
well as the surface morphology of the substrate surface was observed by scanning electron
microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O
and Cu4O3. The SEM results also approve that the anodization spell affects the surface
morphology on substrate surface.
hbk
Physics--Anodization--Copper--Subtract
535.01 / St894
Structural Analysis of Anodization of Copper Substrate / Zeeshan Asghar - Lahore : Division of Science & Technology, University of Education 2018 - 48 p. CD
Copper oxide thin films are amalgamated on the copper substrate at room temperature via by
means of the anodization method. Cu-substrate is employed in sodium hydroxide solution then
space among electrodes is kept perpetual though out experimentation. Anodization spell changes
in a constant as well as regular routine to study the time effect of anodization of Cu, whereas
other constraints like voltage, temperature etc. are kept perpetual through the experimental
method. Crystallographic studies of fused thin films were analyzed via using X-ray diffraction as
well as the surface morphology of the substrate surface was observed by scanning electron
microscope. The XRD analysis illustrate that the development of various phases of CuO, Cu2O
and Cu4O3. The SEM results also approve that the anodization spell affects the surface
morphology on substrate surface.
hbk
Physics--Anodization--Copper--Subtract
535.01 / St894
